BERGQUIST GAP PAD TGP HC 3000
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Thermally Conductive Gap Pad for Fragile Applications with Low Compression Stress
BERGQUIST GAP PAD TGP HC 3000 offers a thermally conductive solution designed for fragile applications, providing low compression stress and excellent wettability. Its inherent tack on both sides ensures easy handling and placement. At Shri Mahaluxmi Chemicals, we offer this unreinforced and reinforced gap-filling pad to meet your thermal management needs with efficiency and reliability.
- Thermally Conductive, Un-Reinforced & Reinforced Gap Filling pad
- Low compression stress & so ideal for fragile applications
- Inherent tack on both sides
- Excellent wettability
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