BERGQUIST GAP PAD TGP 1500
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Low Hardness Gap Pad for Enhanced Thermal Conductivity and Conformability
The BERGQUIST GAP PAD TGP 1500 is a thermally conductive, unreinforced gap-filling pad offering good conformability and low modulus for superior thermal management. Its low hardness and inherent tack on both sides ensure easy application in sensitive areas. At Shri Mahaluxmi Chemicals, we provide this pad to offer effective thermal solutions with excellent flexibility and ease of use.
- Thermally Conductive, Un-Reinforced Gap Filling pad
- Low modulus
- Inherent tack on both sides
- Good conformability, having low hardness
Properties
