Low Pressure Molding
Streamlined protection for delicate electronics!
Molding Solutions from trusted brands!
Electronic components need reliable protection from moisture, chemical exposure, and high temperatures. Standard production processes with bonding and encapsulation take time and can present design limitations.
SMLC, in collaboration with Henkel, offers TECHNOMELT® and LOCTITE® low pressure molding material solutions that provide excellent protection while streamlining the production cycle. Ideal for Medical, Electronic Components, Power & Industrial Automation, HVAC, and Lighting applications, LOCTITE® materials meet Henkel’s protocols based on ISO-10993 biocompatibility standards—certificates available on request.
The simplicity of these products is their advantage
- Low pressure ensures no damage to fragile circuitry
- Short cycle times for efficient production
- Effective protection against moisture, chemicals, and temperature extremes
