BERGQUIST® LIQUI FORM TLF 6000HG
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BERGQUIST® LIQUI FORM TLF 6000HG – High-Performance Thermal Interface Gel
BERGQUIST® LIQUI FORM TLF 6000HG is a one-part, gray, silicone-based thermal interface gel designed for superior thermal management. Fully cured, this gel offers a balanced combination of excellent thermal reliability, efficient dispensing, and high thermal conductivity. It is ideal for electronic component thermal management in remote antennas and 5G base stations, effectively filling gaps up to 3.0mm with robust vertical gap stability.
- High Thermal Conductivity: Provides reliable thermal management for electronic components.
- Efficient Dispensing: Ensures smooth application with minimal waste.
- Gap Filling: Conforms to larger gaps up to 3.0mm with vertical stability.
- Versatile Applications: Ideal for remote antennas, 5G base stations, and thermal-sensitive components.
Perfect for advanced thermal management in telecommunications and electronic assemblies.
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